From November 13th to 14th, the head of the ISSP UL’s Laboratory of Organic Materials, Aivars Vembris and the same lab’s researcher, Arturs Bundulis, participated in the EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin in Munich, Germany. This meeting provided a platform for gaining comprehensive insights into the latest innovations and challenges within the field of photonics from an industrial perspective.
The event spotlighted the industrial importance of photonic integrated circuits and various platforms. Key players like Lightwave Logic, Intel, NTS Optel, Plasma-Therm, IMEC, and PI (Physik Instrumente) showcased their progress and insights.
Aivars Vembris presented the Polymer Photonics Platform developed by the ISSP UL. It garnered attention, fostering valuable feedback from industry experts. Through active participation, a deeper understanding of the challenges associated with photonics integrated circuits in the industry was achieved, paving the way for future collaborations and advancements in the field.
Parallel to that, new industrial connections were established exploring the potential for a polymer photonics pilot line. Among these connections, Vanguard Photonics stood out for its pioneering approaches to light coupling in PICs using 3D lithography. Their synergistic methodology demonstrated compatibility with polymer photonics, hinting at a potential integration of their techniques into the packaging processes of polymer photonics.
The EPIC Microelectronics & Photonics Meeting aims to address technology and manufacturing challenges and opportunities in the microelectronics and photonics industries. Key industry actors from both fields convene to explore how they can collaborate to solve each other’s problems and learn from one another. Participants from across the entire manufacturing value chain, including design, manufacturing, testing, packaging, equipment, and materials, attend the event, which is known for its extensive networking opportunities.